Gluing with Perfection
interpack, the leading international trade fair for the packaging industry, takes place from May 4 to 10, 2017, in Düsseldorf, Germany. Under the motto Gluing with Perfection, Robatech is presenting 5 highlights for the latest application technologies for an optimized gluing process in different applications.
Each of these topics is featured at a dedicated topic island at the Robatech booth. Visitors can learn how they can benefit from the different Robatech services for a perfect adhesive application.
May 4-10, 2017
Hall 11, Stand F68